The MRSI-M5 uses an advanced technology cast composite base for fast moves with virtually no settling time. The large work envelope is flexible for a variety of configurations depending on customer need. The major system axes use brushless DC linear servo motors with linear glass-scale encoder feedback for high speeds and accurate movements. |
The system’s closed-loop force control of die placements enables placing delicate Gallium Arsenide (GaAs) die with as little as 10 grams of force. Using programmable higher forces, the system is also capable of eutectic bonding with complete scrub and temperature control. For applications such as these, die are picked from waffle pack, Gel-Pak™, wafer, and tape and reel. The MRSI-M5 is also configurable with epoxy dispense pumps and epoxy stamping for a complete assembly solution. |
The MRSI-M5 operates on Newport’s Windows workcell software. This user-friendly software operates all Newport Advanced Packaging Assembly and Dispense systems and provides excellent process control and extensive interchangeability with other Newport Advanced Packaging equipment. |
MRSI-M5 Product Advantages: |
360° Die Orientation |
The MRSI-M5 features an advanced vision system that enables the rapid detection and orientation of die over a full 360°. Boundary trace or pattern match is used to locate the die center or application critical features. This fast orientation enables die such as MMICS and lasers to be used directly from the supplier without any need for pre-orientation |
Force Control |
Closed-loop force feedback enables delicate handling of Gallium Arsenide (GaAs) and Indium Phosphide (InP) devices as well as MEMS devices with fragile microstructures. Die are placed with forces as low as 10 grams. Force is programmed per placement so that each die can be picked and placed with a programmed and controlled force. |
Waffle Packs – Gel-Paks™ |
The large open work area ensures there is always enough room to hold the components necessary for the job. The standard system holds 72 2 x 2” waffle packs or a mix of 2 x 2” and 4 x 4” waffle packs. Gel-Paks are easily used with an integrated vacuum pull down system. Waffle pack feeders are easily integrated or waffle pack adapters can be used with the automatic wafer changer. |
Wafer |
The MRSI-M5 features an automatic wafer change from cassette. Two wafers are handled simultaneously so that a new wafer can be loaded immediately upon unloading the finished wafer. Wafer mapping of good and bad die plus ink dot detection enable factory integration and rapid wafer change. |
Alternate wafer domes for different needle clusters are easily exchanged. Needle speeds are programmable with different speeds per eject for control of large thin die. The movement of the ejection needles is synchronized with the pick head to eliminate breakage. |
Tool Change |
The MRSI-M5 features a thirteen-position tool bank with fast automatic tool change. Additional tool change banks are added for a wider range of tools. The tool change banks hold round surface pick-up tips, perimeter and inverted pyramid collets, and stamping tools. |
Vision Alignment |
Fast vision alignment is achieved by combining edge detection and pattern match. A large library of shape codes is available for basic feature finding. Advanced pattern match is identifies, orients, and aligns the die features. |
Dual magnification cameras through a single optical path find the die and align it according to die fiducials with no XY movement. Variable ring and collimated multi-color lighting processes the most challenging materials. Global and local vision alignments are used for nested substrates and features. This enables fast, error-free processing of complex assemblies |
Programmable Multi-Color Lighting |
Lighting intensity is programmable for both the ring and collimated lights for each camera. The optimal light setting is determined while teaching die and alignments. That setting is used by the system while in production. Different light settings are optimized for locating die in the waffle pack and then for locating alignment fiducials on the die surface. |
Multi-Color lighting is used to process a wide range of materials. Red, green and blue programmable lighting more robust while processing challenging alignment surfaces such as gold on alumina. The more robust vision system means production is not interrupted for missed alignments. |
Eutectic Capability |
The MRSI-M5 is equipped with eutectic bonding capability. This capability includes the addition of a 1.5"x3" hot plate reflow station with fast temperature ramping capability. A heated cover gas of Hydrogen and Nitrogen is present over the hot plate. The system automatically transports the substrate or package to and from the stage for eutectic stage for bonding. The design of the hot plate reflow station includes provisions for vacuum hold down. |
The eutectic station is programmable to match the requirements of the eutectic process. The temperature ramp rates are programmable to optimize the heating of the parts while avoiding thermal shock. Multiple temperatures are programmed to bring the substrate to a base temperature before the final rise to the reflow temperature once the part is placed. A mechanical scrub is programmable to optimize bonding quality. |
Progressive Heated Boat Indexer |
The highest eutectic throughputs are achieved with the MRSI-M5 configured with a progressive heated boat indexer. The conveyor transfers the boat to the bonding area as it incrementally heats the package to the process temperature by passing over preheat zone positions and then clamps the package at the eutectic assembly stage. The substrate is bonded at this point without being lifted to a separate assembly stage. After bonding, the boat is indexed so that the next preheated part is presented to the stage for bonding. The boat travels through a tunnel of hydrogen-nitrogen cover gas to prevent oxidation. |
Material Handling Systems |
The MRSI-M5 processes boats, custom trays, and lead frames as part of a fully integrated SMEMA production line. Magazine pitch, conveyor speeds, and other parameters are easily taught with a Teach Wizard. The system is also operates in a standalone mode. A fixed stage is used to build parts in an easily loaded tray. |
Dispense Capability |
Two dispense pumps are mounted on the robot head for a complete assembly solution. Cartridge style positive displacement pumps are used with closed loop servo motors. This provides precise control of epoxy volume when dispensing small dots or area fills. |
Flip Chip Bonding |
An uplooking camera and flux well is available for high accuracy – force controlled placements of flip chip devices. |
Epoxy Stamping |
A rotating stamping well with multiple epoxy grooves presents epoxy for stamping. A micrometer controlled doctor blade determines dot size. |
Stamping (or daubing) tools are interchangeable with standard pickup tools and are used to create very small epoxy dots by touching down in the stamping well and then on the substrate. Dots as small as 0.004” (100 microns) are possible or ganged stamping tools can be used to place multiple dots simultaneously. |
Calibration |
An automatic homing routine occurs at machine startup, otherwise no routine calibration is necessary. |
Newport Windows Workcell Software |
The MRSI-M5's intuitive graphical user interface runs on Windows™ and simplifies the set-up and production process. The XML database is shared by all taught programs so that die and waffle packs taught for one job are available for others. Die and substrate teaching are wizard guided and are taught and edited in just minutes. Some die bonding specific features include: |
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Flexibility: Changes to programs are made easily through pull down menus.- Offline programming: Easy export of programs for offline tuning and programming with CAD data.
- CAD download: Easy import of CAD coordinates for a fast startup.
- Alternate die allows for the automatic substitution of different appearing die from an alternate vendor
- Traceability Software tracks each die and creates a record of all die used per substrate. Process parameters such as force and temperature are also recorded. The traceability file is formatted as comma delimited or XML and can be automatically uploaded to a network server.
- Tip overlay indicates the true size of the pick up tip while teaching the pickup location of a die to avoid air bridges.
- ‘List view’ presents a list of all placement locations and parameters in a spreadsheet format for easy comparison and tuning.
- Production optimization is achieved by performing all alignments at the start of production to enable unmonitored production
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Large work area for 72 waffle packs, wafer, and tape and reel feeders
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Dual magnification cameras with a shared optical path for fast location of die and fiducials
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Fast tool change for a large range of tips and custom collets
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Multiple epoxies with multiple stamping tools enable stamping of a large variety of dot materials and sizes
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Flip chip bonding using the up-looking camera
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